Leading chip producer TSMC appears to be set to begin production of its 3nm chips later this year, which is good news for Apple’s next-generation processors.
A new DigiTimes Asia report says the company is on track to manufacture 30,000 to 35,000 wafers using 3nm process technology. iPads are expected to be the first Apple product to feature the chips, according to Wccftech, although no specific model was mentioned.
Apple’s M3 and A17 chips are expected to debut in 2023 for iPhone, iPad and Mac. These chips will offer better performance and improved battery life, and previous rumors indicate that the 3nm chips will feature four dies, which would allow for up to 40 cores. The Apple M1 chip, on the other hand, has eight cores while the M1 Pro and M1 Max have up to 10 cores.
Analysis: Is TSMC late?
This new report corroborates previous rumors regarding TSMC’s 3nm chip production schedule. However, there was some disturbing news earlier this year which suggested the tech giant might be having trouble producing the chips.
The semiconductor production process is delicate and it is not uncommon to have defective batches as a side effect. Although many of these faulty chips can then be repurposed for less powerful versions, too many errors could be disastrous.
TSMC holds a high position in the semiconductor industry, especially with the shortage of semiconductors, because it is able to provide a steady supply of chips to other companies. But if TSMC fails to get its 3nm process under control, it could impact AMD, with Nvidia and others expected to rely on 5nm technology instead.